System impact of > 50 Gb/s per linear cm

• Multi-GByte/s data rate per linear cm
• USC - HP PONI DARPA program can provide > 50 Gb/s per cm using
  • USC interface IC
  • 12-wide fiber ribbon, 2.5 Gb/s per fiber signaling, and MTP connector
  • BGA surface mount to PCB

HP PONI Tx-module

IBM 8265 Nways ATM switch

12.8 Gb/s capacity, ~ 1 m back-plane

HP PONI module +

USC interface IC supports

> 4X capacity

IBM ATM switch

in 1 cm form-factor

Previous slide

Next slide

Back to first slide

View graphic version