PPT Slide

VLSI CMOS

OSA attachment

VLSI CMOS 1 cm2

> 2000 BGA and OBGA

optical / electrical / thermal contacts

Plastic OSA

Direct CMOS to optical I/O

Seal and structural integrity

MCM-L substrate

C4 or wire bond

from plastic over-mold with

integrated heat spreader

for thermal management

Plastic over-mold and

integrated heat spreader

Future MCM-L packaging for direct CMOS to optical I/O

BGA

• Combines CMOS VLSI function with dense high-speed optical I/O

• Standard-cell opto-electronic CMOS interface

• Separate optical and electrical thermal management using integrated heat spreader

• Signal rate > 2.5 Gb/s per I/O

Optical BGA feed

Previous slide

Next slide

Back to first slide

View graphic version